Technological
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- Core Competence
--Rigid-Flex PCB Expert
·Production capacity of professional experience
-- Gold plate expert
·The level of the leading gold plate production process with
1. 0.03um gold plating less common Common gold plating below 0.03um excellent solderability Well solder abitilt y
2. Immersion gold 0.06um these Electroless plating gold below 0.06um thick gold imitation of the appearance of Imitating the thick gold appearance
3. Electroplating soft thick gold 0.1-2um Flex thick gold plating 0.1-2um high purity, easy bonding High purity and easy to stick
4. Electroplating hard and thick gold 0.1-3um Rigid thick gold plating 0.1-3um resistant to salt spray resistance, nitric acid Resistance of salt spray and nitric acid
2. Immersion gold 0.06um these Electroless plating gold below 0.06um thick gold imitation of the appearance of Imitating the thick gold appearance
3. Electroplating soft thick gold 0.1-2um Flex thick gold plating 0.1-2um high purity, easy bonding High purity and easy to stick
4. Electroplating hard and thick gold 0.1-3um Rigid thick gold plating 0.1-3um resistant to salt spray resistance, nitric acid Resistance of salt spray and nitric acid