技术优势
-- 软硬结合板专家
·专业的制作能力与大规模量产经验
-- 金板专家
·领先的金板制作水平与多种多样的加工工艺
1.镀普通金 0.03um以下Common gold plating below 0.03um 优良的可焊性Well solder abitilt y
2.化学沉金 0.06um以下Electroless plating gold below 0.06um仿厚金外观Imitating the thick gold appearance
3.电镀软厚金 0.1-2um Flex thick gold plating 0.1-2um高纯度，易邦定High purity and easy to stick
4.电镀硬厚金 0.1-3um Rigid thick gold plating 0.1-3um耐盐雾，耐硝酸Resistance of salt spray and nitric acid
2.化学沉金 0.06um以下Electroless plating gold below 0.06um仿厚金外观Imitating the thick gold appearance
3.电镀软厚金 0.1-2um Flex thick gold plating 0.1-2um高纯度，易邦定High purity and easy to stick
4.电镀硬厚金 0.1-3um Rigid thick gold plating 0.1-3um耐盐雾，耐硝酸Resistance of salt spray and nitric acid